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Rumor mill: Main CPU producers are frequently engaged in growing new chip architectures and merchandise. The rumor mill is ceaseless, and a latest Chinese language supply has now divulged detailed enterprise plans for 3 of the world’s largest chipmakers.
A Chinese language content material creator has unveiled a complete roadmap for future CPUs from Intel, AMD, and Qualcomm. The roadmap supplies particulars about upcoming chip architectures, a few of which have been already recognized, and extra data, probably from unofficial however well-informed sources.
Beginning with Intel, the video from “Golden Pig Improve Pack” outlines Intel’s CPU strains and architectures deliberate for 2024 and 2025. These plans embody a Raptor Lake refresh for barely sooner desktop CPUs, and laptops that’ll characteristic Meteor Lake.
Intel-based transportable programs can even obtain up to date Raptor Lake (Core Gen thirteenth) processors, though the inclusion of Meteor Lake CPUs in gaming laptops could also be an exception. In 2025, Intel will introduce the brand new Arrow Lake structure to switch Raptor Lake-H and HX transportable chip fashions. A refreshed “U-series” choice shall be retained for low-end programs.
The Chinese language leaker has additionally offered an up to date roadmap for AMD. Lisa Su’s firm is presently growing two new APU chips, informally referred to as Strix Halo and Strix Level. Strix Halo is constructed on the brand new Zen 5 microarchitecture and can characteristic conventional (“Traditional”) Zen cores on the brand new “FP11” socket.
Strix Level seems to have a extra intricate design, with two various kinds of Zen 5 cores: “Traditional” and “Dense.” Help for DDR5 and LPDDR5X reminiscence is unique to the Halo chip, whereas each Strix Level and Strix Halo incorporate AMD’s RDNA3.5 GPU structure with 16 Compute Models (Level) and 40 CUs (Halo). AMD can even present refreshed Zen 4 APU choices (Hawk Level, Phoenix) and the “Zen3+” based mostly chip Rembrandt-R for the low-end market.
Lastly, we have now some up to date details about “Hamoa,” the primary Snapdragon X cell SoC created by Qualcomm. Hamoa will characteristic both 10 or 12 CPU cores and an Adreno 740 GPU with help for a further discrete GPU for graphics processing by way of a PCIe Gen4 x8 interface.
The Hamoa SoC additionally provides options for high-speed storage (UFS4, PCIe Gen4 x4 NVMe), LPDDR5X reminiscence help with speeds as much as 8533 MT/s, and quick video encoding capabilities (4K60). Qualcomm seems to be growing a cell chip that might carry out successfully in each next-gen smartphones and ARM laptops.
Now, it is as much as OEM producers to grab the chance and create computing gadgets based mostly on this know-how.
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